K. Scherpinski

Publications

Citations

H-Index

2000

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

K. Scherpinski is an author at Fraunhofer Institute for Reliability and Microintegration specializing in computer engineering, microfabrication, and electronic packaging.

Top concepts

EngineeringMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingElectrical EngineeringThin FilmsApplied PhysicsIntegrated CircuitsPackage Integration

Publications per year

2000–2005

Publications

Thin film integration of passives - single components, filters, integrated passive devices

Kai Zoschke, J.K. Wolf, Michael J. Topper et al. · 2004 · 39 citations

Engineering, Device Integration, Integrated Circuits +20

Wafer-level chip size package (WL-CSP)

Michael J. Topper, S. Fehlberg, K. Scherpinski et al. · IEEE Transactions on Advanced Packaging · 2000 · 30 citations

Electrical Engineering, Chip-scale Package, Engineering +12

Fabrication of application specific integrated passive devices using wafer level packaging technologies

Kai Zoschke, J.K. Wolf, Michael J. Topper et al. · 2005 · 16 citations

Flip Chip, Integrated Passive Devices, Electrical Engineering +15

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