Publication | Closed Access
Bump formation for flip chip and CSP by solder paste printing
30
Citations
1
References
2002
Year
Materials ScienceFlip ChipEngineeringAdvanced Packaging (Semiconductors)MicrofabricationBump FormationChip On BoardMechanical EngineeringFabrication TechniquePrinted ElectronicsChip AttachmentElectronic PackagingSolder Paste Printing
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