1
Publications
49
Citations
1
H-Index
1997
Active since
Affiliations
G. Motulla is an author at Fraunhofer Institute for Reliability and Microintegration specializing in mechanical engineering, electronic packaging, and microfabrication.
Top concepts
EngineeringApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingFlexible ElectronicsMechanical Engineering
Publications per year
1997–1997
1
1
Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
R. Aschenbrenner, Andreas Ostmann, G. Motulla et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1997 · 49 citations
Engineering, Mechanical Engineering, Flip Chip Attachment +16
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