J. Gwiasda

Publications

Citations

H-Index

1994

Active since

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

J. Gwiasda is an author at Fraunhofer Institute for Reliability and Microintegration specializing in microfabrication, electronic packaging, and engineering.

Top concepts

EngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingTechnology3D PrintingSelf-assemblyApplied PhysicsSurface Science

Publications per year

1994–1996

Publications

Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy

E. Zakel, J. Gwiasda, J. Kloeser et al. · 1994 · 21 citations

Engineering, Mechanical Engineering, Flip Chip +21

Low Cost Flip Chip Technologies Based on Chemical Nickel Bumping and Solder Printing

J. Kloeser, J. Gwiasda, E. Zakel et al. · 1996 · 13 citations

Materials Science, Chip-scale Package, Engineering +10

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