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Low Cost Flip Chip Technologies Based on Chemical Nickel Bumping and Solder Printing
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1996
Year
Unknown Venue
Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)MicrofabricationChip On BoardPrinted ElectronicsChip AttachmentChemical Nickel BumpingSolder PrintingElectronic PackagingTechnologyMicroelectronics
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