W. Nüchter

Thermal Spraying of Nanocrystalline Ni Coatings

M. Lau, Hai Jiang, W. Nüchter et al. · physica status solidi (a) · 1998 · 63 citations

Engineering, Mechanical Engineering, Grain Growth Behavior +16

Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue

Andreas Fix, W. Nüchter, Jürgen Wilde · Soldering and Surface Mount Technology · 2008 · 62 citations

Engineering, Microstructural Changes, Severe Plastic Deformation +18

Microstructural development of Sn-Ag-Cu solder joints

Andreas Fix, Gabriel A. López, Ingo Brauer et al. · Journal of Electronic Materials · 2005 · 43 citations

Materials Engineering, Materials Science, Friction Welding +5

Electron channelling: A method in real-space crystallography and a comparison with the atomic location by channelling-enhanced microanalysis

W. Nüchter, Wilfried Sigle · Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties · 1995 · 30 citations

X-ray Crystallography, Engineering, Microscopy +20

Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis

S. Deplanque, W. Nüchter, Bernhard Wunderle et al. · 2006 · 28 citations

Engineering, Mechanical Engineering, Lifetime Prediction +22