Statistics
Publications
19
Citations
499
H-Index
15
Active since
2010
R. Kahle is an author at Technische Universität Berlin specializing in engineering, advanced packaging, and electronic packaging.
Publications per year
2010–2022
19
19
Large area compression molding for Fan-out Panel Level Packing
Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 76 citations
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · Micromachines · 2019 · 50 citations · Full text
From wafer level to panel level mold embedding
Tanja Braun, K.-F. Becker, S. Voges et al. · 2013 · 44 citations
Through mold vias for stacking of mold embedded packages
Tanja Braun, K.-F. Becker, S. Voges et al. · 2011 · 40 citations
Panel Level Packaging - A View Along the Process Chain
Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2018 · 39 citations
Engineering, Industrial Engineering, Integrated Circuits +23
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