Concepedia

R. Kahle

RK

Statistics

Publications

19

Citations

505

H-Index

15

Active since

2010

Affiliations

Technische Universität Berlin(Current)

Fraunhofer Institute for Reliability and Microintegration

Robert Bosch (Germany)

Robert Bosch (Taiwan)

R. Kahle is an author at Technische Universität Berlin specializing in engineering, packaging engineering, and wafer-level packaging.

Publications per year

2010–2022

19

Publications

19

Large area compression molding for Fan-out Panel Level Packing

Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 77 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +11

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · Micromachines · 2019 · 51 citations · Full text

Engineering, Manufacturing Engineering, Energy Systems +14

From wafer level to panel level mold embedding

Tanja Braun, K.-F. Becker, S. Voges et al. · 2013 · 44 citations

Engineering, Manufacturing Engineering, Materials Science +14

Through mold vias for stacking of mold embedded packages

Tanja Braun, K.-F. Becker, S. Voges et al. · 2011 · 40 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

Panel Level Packaging - A View Along the Process Chain

Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck et al. · 2018 · 40 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +13

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