K.-F. Becker

Statistics

Publications

Citations

443

H-Index

Active since

2000

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Robert Bosch (Germany)

Robert Bosch (Taiwan)

K.-F. Becker is an author at Fraunhofer Institute for Reliability and Microintegration specializing in microfabrication, microelectronics, and electronic packaging.

Top concepts

EngineeringMicrofabricationElectronic PackagingMicroelectronicsComputer EngineeringElectrical EngineeringAdvanced Packaging3D PrintingMaterial ScienceComputer Architecture

Publications per year

2000–2017

Publications

Large area compression molding for Fan-out Panel Level Packing

Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 76 citations

Advanced Packaging, Chip-scale Package, Engineering +15

From wafer level to panel level mold embedding

Tanja Braun, K.-F. Becker, S. Voges et al. · 2013 · 44 citations

Through mold vias for stacking of mold embedded packages

Tanja Braun, K.-F. Becker, S. Voges et al. · 2011 · 40 citations

Large Area, Engineering, Mechanical Engineering +23

Stackable system-on-packages with integrated components

K.-F. Becker, Erik Jung, Andreas Ostmann et al. · IEEE Transactions on Advanced Packaging · 2004 · 38 citations

Engineering, Computer Architecture, Integrated Circuits +21

Development of a Multi-project Fan-Out Wafer Level Packaging Platform

Tanja Braun, S. Raatz, Marius van Dijk et al. · 2017 · 32 citations

Engineering, Computer Architecture, Multi-layer Structure +16

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