K.-F. Becker

Statistics

Publications

Citations

444

H-Index

Active since

2000

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Technische Universität Berlin

Robert Bosch (Germany)

Robert Bosch (Taiwan)

K.-F. Becker is an author at Fraunhofer Institute for Reliability and Microintegration specializing in engineering, packaging design, and chip packaging.

Publications per year

2000–2017

Publications

Large area compression molding for Fan-out Panel Level Packing

Tanja Braun, S. Raatz, S. Voges et al. · 2015 · 77 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +11

From wafer level to panel level mold embedding

Tanja Braun, K.-F. Becker, S. Voges et al. · 2013 · 44 citations

Engineering, Manufacturing Engineering, Materials Science +14

Through mold vias for stacking of mold embedded packages

Tanja Braun, K.-F. Becker, S. Voges et al. · 2011 · 40 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

Stackable system-on-packages with integrated components

K.-F. Becker, Erik Jung, Andreas Ostmann et al. · IEEE Transactions on Advanced Packaging · 2004 · 38 citations

Engineering, Computer Engineering, Electrical Engineering +17

Development of a Multi-project Fan-Out Wafer Level Packaging Platform

Tanja Braun, S. Raatz, Marius van Dijk et al. · 2017 · 32 citations

Engineering, Electrical Engineering, Electronic Materials +16

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