Concepedia

Mems Device Packaging

MEMS Device Packaging is a specialized microfabrication process that integrates and encapsulates micro-electro-mechanical systems to protect their functional components, ensure mechanical stability, enable electrical interconnection, and facilitate environmental interaction while maintaining performance at the microscale.

420

Publications

14.9K

Citations

1.5K

Authors

322

Institutions

Publications per year

2017–2026

40

Parents

Publications

420

Ultrananocrystalline diamond thin films for MEMS and moving mechanical assembly devices

A.R. Krauss, Orlando Auciello, D. M. Gruen et al. · Diamond and Related Materials · 2001 · 367 citations

, , +11

Integrating MEMS and ICs

Andreas Fischer, Fredrik Forsberg, Martin Lapisa et al. · Microsystems & Nanoengineering · 2015 · 355 citations · Full text

, , +17

Wafer level packaging of MEMS

Masayoshi Esashi · Journal of Micromechanics and Microengineering · 2008 · 353 citations

, , +17

SiC MEMS: opportunities and challenges for applications in harsh environments

Mehran Mehregany, Christian A. Zorman · Thin Solid Films · 1999 · 320 citations

, , +14

Surface processes in MEMS technology

Roya Maboudian · Surface Science Reports · 1998 · 277 citations

, , +12

1–5 of 420

Authors

1.5K

  1. AW
    Ann Witvrouw

    IMEC, Belgium

    12 publications · 362 citations

    11

    h-index

  2. TW
    Thomas W. Kenny

    Stanford University, United States

    9 publications · 337 citations

    9

    h-index

  3. KN
    K. Najafi

    University of Michigan, United States

    8 publications · 356 citations

    8

    h-index

  4. WP
    Woo‐Tae Park

    Seoul National University of Science and Technology, South Korea

    7 publications · 303 citations

    7

    h-index

  5. HT
    H.A.C. Tilmans

    IMEC, Belgium

    7 publications · 266 citations

    7

    h-index

1–5 of 1.5K

Institutions

322

  1. IMEC

    Leuven, Belgium

    15 h-index

    105 publications

    2.7K citations

  2. University of Michigan

    Ann Arbor, United States

    13 h-index

    39 publications

    1.4K citations

  3. Georgia Institute of Technology

    Atlanta, United States

    12 h-index

    42 publications

    1.1K citations

  4. Analog Devices (United States)

    Norwood, United States

    11 h-index

    40 publications

    1.2K citations

  5. KU Leuven

    Leuven, Belgium

    10 h-index

    21 publications

    556 citations

  6. Institute of Microelectronics

    Singapore, Singapore

    10 h-index

    42 publications

    886 citations

  7. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    9 h-index

    36 publications

    1.1K citations

  8. University of California, Berkeley

    Berkeley, United States

    9 h-index

    20 publications

    1.2K citations

1–8 of 322

Venues

  1. Sensors and Actuators A Physical

    33 publications · 1.3K citations

    22

    h-index

  2. Journal of Microelectromechanical Systems

    27 publications · 1K citations

    20

    h-index

  3. Journal of Micromechanics and Microengineering

    JMM · 25 publications · 1.4K citations

    17

    h-index

  4. Microsystem Technologies

    18 publications · 462 citations

    14

    h-index

  5. 14

    h-index

1–5