Martin Lapisa

Integrating MEMS and ICs

Andreas Fischer, Fredrik Forsberg, Martin Lapisa et al. · Microsystems & Nanoengineering · 2015 · 346 citations · Full text

Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS

Martin Lapisa, Göran Stemme, Frank Niklaus · IEEE Journal of Selected Topics in Quantum Electronics · 2011 · 131 citations · Full text

Engineering, Device Integration, Wafer-level Heterogeneous Integration +16

Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs

Frank Niklaus, Adit Decharat, Fredrik Forsberg et al. · Sensors and Actuators A Physical · 2009 · 43 citations · Full text

Electrical Engineering, Wafer Scale Processing, Engineering +11

One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration

Fabian Zimmer, Martin Lapisa, Thor Bakke et al. · Journal of Microelectromechanical Systems · 2011 · 37 citations

Optical Materials, Engineering, Device Integration +19

CMOS-Integrable Piston-Type Micro-Mirror Array for Adaptive Optics Made of Mono-Crystalline Silicon using 3-D Integration

Martin Lapisa, Fabian Zimmer, Frank Niklaus et al. · 2009 · 22 citations

Optical Materials, Engineering, Integrated Circuits +19