Fabian Zimmer

Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs

Frank Niklaus, Adit Decharat, Fredrik Forsberg et al. · Sensors and Actuators A Physical · 2009 · 43 citations · Full text

Electrical Engineering, Wafer Scale Processing, Engineering +11

One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration

Fabian Zimmer, Martin Lapisa, Thor Bakke et al. · Journal of Microelectromechanical Systems · 2011 · 37 citations

Optical Materials, Engineering, Device Integration +19

Development of a NIR microspectrometer based on a MOEMS scanning grating

Fabian Zimmer, Heinrich Grueger, Andreas Heberer et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2004 · 24 citations

Short Wavelength Optic, Optical Materials, Engineering +23

CMOS-Integrable Piston-Type Micro-Mirror Array for Adaptive Optics Made of Mono-Crystalline Silicon using 3-D Integration

Martin Lapisa, Fabian Zimmer, Frank Niklaus et al. · 2009 · 22 citations

Optical Materials, Engineering, Integrated Circuits +19

Drift-Free Micromirror Arrays Made of Monocrystalline Silicon for Adaptive Optics Applications

Martin Lapisa, Fabian Zimmer, Göran Stemme et al. · Journal of Microelectromechanical Systems · 2012 · 17 citations

Optical Materials, Engineering, Device Integration +18