T.-M. Winkel

Extraction of /spl epsiv//sub r/(f) and tan/spl delta/(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique

A. Deutsch, T.-M. Winkel, G.V. Kopcsay et al. · IEEE Transactions on Advanced Packaging · 2005 · 60 citations

Engineering, Electrical Engineering, Materials Science +17

Determination of the propagation constant of coupled lines on chips based on high frequency measurements

T.-M. Winkel, L.S. Dutta, H. Grabinski et al. · 2002 · 27 citations

Engineering, Electrical Engineering, Circuit Theory +16

First- and second-level packaging of the z990 processor cage

T.-M. Winkel, Dale Becker, H. Harrer et al. · IBM Journal of Research and Development · 2004 · 20 citations

Engineering, Computer Engineering, Computer Science +17

First- and second-level packaging for the IBM eServer z900

H. Harrer, H. Pross, T.-M. Winkel et al. · IBM Journal of Research and Development · 2002 · 17 citations

Engineering, Computer Engineering, Electrical Engineering +17

Accuracy of dielectric constant measurement using the full-sheet-resonance technique IPC-TM-650 2.5.5.6

A. Deutsch, August J. Huber, G.V. Kopcsay et al. · Electrical Performance of Electronic Packaging · 2003 · 13 citations

Natural Sciences, Electrical Engineering, Materials Science +17