Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder

Interfacial reaction issues for lead-free electronic solders

Cheng–En Ho, Shenghao Yang, C. R. Kao · Journal of Materials Science Materials in Electronics · 2006 · 272 citations

Natural Sciences, Materials Engineering, Materials Science +12

Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

Min He, Zhong Chen, Guo-Jun Qi · Acta Materialia · 2004 · 205 citations

Natural Sciences, Materials Engineering, Materials Science +17

Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

Xin Deng, G. Piotrowski, Jason Williams et al. · Journal of Electronic Materials · 2003 · 157 citations

Natural Sciences, Materials Engineering, Materials Science +14

Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

D. R. Flanders, Elizabeth G. Jacobs, Russell F. Pinizzotto · Journal of Electronic Materials · 1997 · 134 citations

Natural Sciences, Materials Engineering, Materials Science +14

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

Hiren R. Kotadia, Omid Mokhtari, M.P. Clode et al. · Journal of Alloys and Compounds · 2011 · 120 citations

Natural Sciences, Materials Engineering, Materials Science +12