Min He

Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

Min He, Zhong Chen, Guo-Jun Qi · Acta Materialia · 2004 · 205 citations

Natural Sciences, Materials Engineering, Materials Science +17

Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

Min He, Wee Hua Lau, Guo-Jun Qi et al. · Thin Solid Films · 2004 · 87 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +13

Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization

Zhong Chen, Min He, Guo-Jun Qi · Journal of Electronic Materials · 2004 · 82 citations

Engineering, Materials Engineering, Materials Science +17

Strength, microstructure, CO2 emission and economic analyses of low concentration phosphoric acid-activated fly ash geopolymer

Min He, Zongbao Yang, Ning Li et al. · Construction and Building Materials · 2023 · 82 citations · Full text

Engineering, Materials Engineering, Materials Science +13

Nitrogen losses from soil as affected by water and fertilizer management under drip irrigation: Development, hotspots and future perspectives

Junzeng Xu, Yuzhou Liu, Dong Wang et al. · Agricultural Water Management · 2024 · 75 citations · Full text

Agriculture, Agronomy, Soil Sciences +17