Concepedia

Wee Hua Lau

WH

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Publications

1

Citations

87

H-Index

1

Active since

2004

Affiliations

Singapore Institute of Manufacturing Technology(Current)

Wee Hua Lau is an author at Singapore Institute of Manufacturing Technology specializing in intermetallic compound formation, soldered joints, and metallic materials.

Publications per year

2004–2004

1

Publications

1

Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

Min He, Wee Hua Lau, Guo-Jun Qi et al. · Thin Solid Films · 2004 · 87 citations · Full text

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