Jason Williams

Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

F. Ochoa, Jason Williams, Nikhilesh Chawla · Journal of Electronic Materials · 2003 · 189 citations

Materials Engineering, Materials Science, Engineering +7

Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

Xin Deng, G. Piotrowski, Jason Williams et al. · Journal of Electronic Materials · 2003 · 157 citations

Materials Science, Materials Engineering, Initial Morphology +11

Unmet needs for analyzing biological big data: A survey of 704 NSF principal investigators

Lindsay Barone, Jason Williams, David Micklos · PLoS Computational Biology · 2017 · 155 citations · Full text

Damage evolution in SiC particle reinforced Al alloy matrix composites by X-ray synchrotron tomography

Jason Williams, Z. Flom, A. Amell et al. · Acta Materialia · 2010 · 135 citations

Materials Science, Damage Mechanism, Metal Matrix Composite +8

Three dimensional (3D) microstructure-based modeling of interfacial decohesion in particle reinforced metal matrix composites

Jason Williams, Javier Segurado, Javier LLorca et al. · Materials Science and Engineering A · 2012 · 119 citations

Materials Science, Metal Matrix Composite, Engineering +9