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Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

Materials ScienceMaterials EngineeringInitial MorphologyEngineeringCorrosionApplied PhysicsMetallurgical InteractionSn-ag Solder/cu JointsHot WorkingCu3sn IntermetallicsWeld Pool SolidificationThermomechanical ProcessingMicrostructureMetal Processing