Concepedia

Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

Xin Deng, G. Piotrowski, Jason Williams, Nikhilesh Chawla

Journal of Electronic Materials · 2003 · 157 citations · 26 references

DOI

Concepts

References

26

Theory of Thermal Grooving

W. W. Mullins · Journal of Applied Physics · 1957 · 2.6K citations

, , +17

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

, , +9

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu · Acta Metallurgica · 1973 · 485 citations

, , +10

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

, , +14

Interstitial Diffusion of Copper in Tin

B. F. Dyson, T. R. Anthony, David Turnbull · Journal of Applied Physics · 1967 · 382 citations

, , +6