Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, Paul T. Vianco · Metallurgical and Materials Transactions A · 1994 · 275 citations

Natural Sciences, Materials Engineering, Materials Science +16

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 272 citations

Natural Sciences, Materials Engineering, Materials Science +14

New Pb-free solder alloy with superior mechanical properties

M. McCormack, S. Jin, G. W. Kammlott et al. · Applied Physics Letters · 1993 · 189 citations

Natural Sciences, Materials Engineering, Materials Science +17

The formation and growth of intermetallics in composite solder

Yujing Wu, Jennifer A. Sees, Cyrus Pouraghabagher et al. · Journal of Electronic Materials · 1993 · 141 citations

Natural Sciences, Materials Engineering, Materials Science +11

The properties of tin-bismuth alloy solders

L.E. Felton, C. H. Raeder, D. B. Knorr · JOM · 1993 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +9