Microstructure evolution of eutectic Sn-Ag solder joints

Reaction-Diffusion in the Cu–Sn System

Masami Onishi, Hideo Fujibuchi · Transactions of the Japan Institute of Metals · 1975 · 235 citations · Full text

Natural Sciences, Materials Science, Physics +14

The growth of Cu-Sn intermetallics at a pretinned copper-solder interface

A.J. Sunwoo, J. W. Morris, George K. Lucey · Metallurgical Transactions A · 1992 · 176 citations

Natural Sciences, Materials Engineering, Materials Science +12

The formation and growth of intermetallics in composite solder

Yujing Wu, Jennifer A. Sees, Cyrus Pouraghabagher et al. · Journal of Electronic Materials · 1993 · 141 citations

Natural Sciences, Materials Engineering, Materials Science +11

The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder

D. R. Frear, D. Grivas, J. W. Morris · Journal of Electronic Materials · 1987 · 99 citations

Natural Sciences, Materials Engineering, Materials Science +5

Developing lead-free solders: A challenge and opportunity

Sungho Jin · JOM · 1993 · 72 citations

Engineering, Materials Engineering, Materials Science +3