Concepedia

Seung Wook Yoon

SW

50

Publications

1.7K

Citations

24

H-Index

1997

Active since

Affiliations

Institute of Microelectronics(Current)

STATS ChipPAC (Singapore)

Korea Advanced Institute of Science and Technology

Agency for Science, Technology and Research

Singapore Science Park

Seung Wook Yoon is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and microelectronics.

Top concepts

Publications per year

1997–2019

50

Publications

50

High RF performance TSV silicon carrier for high frequency application

Soon Wee Ho, Seung Wook Yoon, Qiaoer Zhou et al. · 2008 · 131 citations

, , +17

Thermodynamics-aided alloy design and evaluation of Pb-free solder, SnBiInZn system

Seung Wook Yoon, Jeong Ryong Soh, Hyuck Mo Lee et al. · Acta Materialia · 1997 · 128 citations

, , +2

Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect

Jae-Woong Nah, Jong-ook Suh, K. N. Tu et al. · Journal of Applied Physics · 2006 · 99 citations · Full text

, , +14

Thermodynamic prediction of interface phases at Cu/solder joints

Hyuck Mo Lee, Seung Wook Yoon, Byeong‐Joo Lee · Journal of Electronic Materials · 1998 · 96 citations

, , +7

Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions

Seung Wook Yoon, Patrick Tang, Roger Emigh et al. · 2013 · 79 citations

, , +14

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