A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

Abstract

The amount of IP traffic in data centers has been doubling approximately every 2–3 years and high-performance optical transceivers are required to handle such data. We propose a heterogeneous packaging of Optical Engines with edge optical coupling for hyper-scale data center application demonstrated using an 800Gbps test vehicle. This platform allows the integration of ICs from diverse technologies such as CMOS, SiGe, SOI, III-V, etc. in small form factor, through wafer-scale electronics-photonics packaging on 300mm wafers. The package offers short electrical interconnects between the photonic integrated circuit and electronic integrated circuit components and the package substrate with minimal signal loss. This high-performance compact OE can be integrated with Application Specific Integrated Circuits, making the package suitable for use in hyper-scale data centres and high-performance computing applications.