Chong Ser Choong

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Vempati Srinivasa Rao, Chai Tai Chong, David Ho et al. · 2016 · 126 citations

Engineering, Computer Engineering, Computer-integrated Manufacturing +15

Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging

Yong Han, Mian Zhi Ding, Lin Bu et al. · 2016 · 29 citations

Engineering, Materials Science, Heat Transfer +12

Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

Vempati Srinivasa Rao, Chai Tai Chong, David Ho et al. · 2017 · 29 citations

Engineering, Manufacturing Engineering, Materials Engineering +15

Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages

Ho Siow Ling, Lin Bu, Chong Ser Choong et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 23 citations

Engineering, Materials Science, Manufacturing Processes +14

A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei et al. · 2023 · 23 citations

Engineering, Computer Engineering, Electrical Engineering +17