Chong Ser Choong

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Vempati Srinivasa Rao, Chai Tai Chong, David Ho et al. · 2016 · 125 citations

Engineering, Mechanical Engineering, Conventional Fowlp Technology +17

Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging

Yong Han, Mian Zhi Ding, Lin Bu et al. · 2016 · 29 citations

Advanced Packaging, Chip-scale Package, Engineering +15

Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

Vempati Srinivasa Rao, Chai Tai Chong, David Ho et al. · 2017 · 29 citations

Fowlp Pop Samples, Engineering, Wafer Scale Processing +17

Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages

Ho Siow Ling, Lin Bu, Chong Ser Choong et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 23 citations

Wafer Level Molding, Engineering, Mechanical Engineering +20

A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packaging

C.S. Premachandran, R. Nagarajan, Zhang Xiolin et al. · 2004 · 22 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +20