Chai Tai Chong

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Vempati Srinivasa Rao, Chai Tai Chong, David Ho et al. · 2016 · 126 citations

Engineering, Computer Engineering, Computer-integrated Manufacturing +15

TSV interposer fabrication for 3D IC packaging

Vempati Srinivasa Rao, Ho Soon Wee, Lee Wen Sheng Vincent et al. · 2009 · 61 citations

Engineering, Electrical Engineering, Materials Science +17

Investigation on the effect of copper leadframe oxidation on package delamination

Chai Tai Chong, A. Leslie, Lim Thiam Beng et al. · 2002 · 52 citations

Engineering, Materials Engineering, Materials Science +15

Effect of TSV interposer on the thermal performance of FCBGA package

Yen Yi Germaine Hoe, Tang Gong Yue, D. Pinjala et al. · 2009 · 37 citations

Engineering, Electrical Engineering, Heat Transfer +16

Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

Vempati Srinivasa Rao, Chai Tai Chong, David Ho et al. · 2017 · 29 citations

Engineering, Manufacturing Engineering, Materials Engineering +15