7
Publications
282
Citations
7
H-Index
1996
Active since
A. Leslie is an author at IBM (United States) specializing in engineering, electronic packaging, and electrical engineering.
Top concepts
EngineeringElectronic PackagingMicroelectronicsComputer EngineeringElectrical EngineeringVlsi DesignComputer ArchitectureChemistryApplied PhysicsSurface Science
Publications per year
1996–2007
7
7
Investigation on the effect of copper leadframe oxidation on package delamination
Chai Tai Chong, A. Leslie, Lim Thiam Beng et al. · 2002 · 52 citations
A Compact eFUSE Programmable Array Memory for SOI CMOS
John Safran, A. Leslie, Gregory Fredeman et al. · 2007 · 27 citations
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