T. Schiml

A 0.13 μm CMOS platform with Cu/low-k interconnects for system on chip applications

T. Schiml, S. Biesemans, G. Brase et al. · 2002 · 53 citations

Low-power Electronics, Electrical Engineering, Engineering +14

65nm cmos technology for low power applications

An Steegen, R. Mo, R. Mann et al. · 2006 · 44 citations

Low-power Electronics, Low Power Applications, Electrical Engineering +13

High performance 50 nm CMOS devices for microprocessor and embedded processor core applications

Shih-Fen Huang, Chih‐Yung Lin, Yu-Shyang Huang et al. · 2002 · 40 citations

Processor Core Applications, Engineering, Vlsi Design +16

A modular 0.13 μm bulk CMOS technology for high performance and low power applications

L.-K. Han, S. Biesemans, J. Heidenreich et al. · 2002 · 27 citations

Low Power Applications, Engineering, Vlsi Design +17

Integration of high-performance, low-leakage and mixed signal features into a 100 nm CMOS technology

T. Schafbauer, J. Brighten, Yi-Cheng Chen et al. · 2003 · 22 citations

Low-power Electronics, Electrical Engineering, Engineering +14