T. Schafbauer

A 0.13 μm CMOS platform with Cu/low-k interconnects for system on chip applications

T. Schiml, S. Biesemans, G. Brase et al. · 2002 · 53 citations

Low-power Electronics, Electrical Engineering, Engineering +14

High performance 50 nm CMOS devices for microprocessor and embedded processor core applications

Shih-Fen Huang, Chih‐Yung Lin, Yu-Shyang Huang et al. · 2002 · 40 citations

Processor Core Applications, Engineering, Vlsi Design +16

Scalability and biasing strategy for CMOS with active well bias

Shih-Fen Huang, C. Wann, Yu-Shyang Huang et al. · 2002 · 31 citations

Low-power Electronics, Electrical Engineering, Engineering +13

Integration of high-performance, low-leakage and mixed signal features into a 100 nm CMOS technology

T. Schafbauer, J. Brighten, Yi-Cheng Chen et al. · 2003 · 22 citations

Low-power Electronics, Electrical Engineering, Engineering +14

Thermal modelling of RTP and RTCVD processes

Alfred Kersch, T. Schafbauer · Thin Solid Films · 2000 · 17 citations

Electrical Engineering, Engineering, Numerical Simulation +11