Lim Thiam Beng is an author at Siemens (Singapore) specializing in mechanical engineering, mineral processing, and chemical engineering.
Top concepts
CorrosionRecycling3D PrintingEngineeringFood PackagingMaterial ScienceMineral ProcessingChemical EngineeringElectronic PackagingMaterials Engineering
Publications per year
2002–2002
1
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Investigation on the effect of copper leadframe oxidation on package delamination
Chai Tai Chong, A. Leslie, Lim Thiam Beng et al. · 2002 · 52 citations
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