David Ho - Concepedia

Author

David Ho

Agency for Science, Technology and Research

Also Known As

D. Ho, David Ho, David Soon Wee Ho

Publications

867

Citations

H-Index

Concepts

All Affiliations

Agency for Science, Technology and Research Institute of Microelectronics Siliconware Precision Industries (Taiwan)

About

David Ho is an author at Agency for Science, Technology and Research specializing in microelectronics, electronic packaging, and engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	18	720
2	Electrical Engineering	12	13	543
3	Computer Engineering	11	12	529
4	Applied Physics	5	5	223
5	Civil Engineering	1	1	16

David Ho

Publications

732

Citations

H-Index

Page 1

	Year	Citations
Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Applied Physics Reviews EngineeringVlsi DesignDevice IntegrationComputer ArchitectureHeterogeneous 2.5D	2015	155
Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications Vempati Srinivasa Rao, Chai Tai Chong, David Ho, EngineeringMechanical EngineeringConventional Fowlp TechnologyWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2016	125
Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology David Ho, Mian Zhi Ding, Xiaowu Zhang EngineeringMechanical EngineeringComputer-aided DesignWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2015	97
Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging David Ho, Mian Zhi Ding, Daniel Rhee MinWoo Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Wafer Scale Processing	2016	82
Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application Zihao Chen, Lim Teck Guan, David Ho Millimeter-wave AntennaGhz Wlan ApplicationEngineeringRadio FrequencyMillimeter Wave Technology	2018	37
Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Fowlp Pop SamplesEngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)Materials Fabrication	2017	29
Through Silicon Via interposer for millimetre wave applications Teck Guan Lim, Yee Mong Khoo, Cheryl Selvanayagam, Silicon Via InterposerEngineeringHigh FrequencySilicon On InsulatorInterconnect (Integrated Circuits)	2011	26
A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Optical MaterialsEngineeringDevice IntegrationIntegrated PhotonicsComputer Architecture	2023	20
Study on Warpage and Reliability of Fan-Out Interposer Technology Fa Xing, David Ho, Tai Chong Chai IEEE Transactions on Components Packaging and Manufacturing Technology Foi TechnologyElectrical EngineeringFan-out Interposer TechnologyEngineeringChip-scale Package	2018	18
Electrical Performances of Fan-Out Embedded Bridge JinWei You, Jay Li, David Ho, EngineeringDevice IntegrationEnergy EfficiencyComputer ArchitectureIntegrated Circuits	2021	17

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