Concepedia

David Ho

DH

19

Publications

732

Citations

14

H-Index

2011

Active since

Affiliations

Agency for Science, Technology and Research(Current)

Institute of Microelectronics

Siliconware Precision Industries (Taiwan)

David Ho is an author at Agency for Science, Technology and Research specializing in microelectronics, electronic packaging, and engineering.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringComputer EngineeringAdvanced PackagingMicrofabricationIntegrated CircuitsComputer ArchitectureMechanical Engineering

Publications per year

2011–2023

19

Publications

19

Heterogeneous 2.5D integration on through silicon interposer

Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka et al. · Applied Physics Reviews · 2015 · 155 citations

Engineering, Vlsi Design, Device Integration +20

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Vempati Srinivasa Rao, Chai Tai Chong, David Ho et al. · 2016 · 125 citations

Engineering, Mechanical Engineering, Conventional Fowlp Technology +17

Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology

David Ho, Mian Zhi Ding, Xiaowu Zhang · 2015 · 97 citations

Engineering, Mechanical Engineering, Computer-aided Design +16

Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging

David Ho, Mian Zhi Ding, Daniel Rhee MinWoo · 2016 · 82 citations

Materials Science, Chip-scale Package, Engineering +14

Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application

Zihao Chen, Lim Teck Guan, David Ho · 2018 · 37 citations

Millimeter-wave Antenna, Ghz Wlan Application, Engineering +10

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