Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application

Abstract

In this paper, a 3D integration package of antenna and chip is proposed. A patch antenna array is integrated with RF chip on fan-out wafer level packaging (FOWLP) platform with two molding compound layers and four metallic layers for 60 GHz wireless local area network (WLAN) application. The patch radiator is fed by a slot in the intermediate metal layers in the package and has small crosstalk with the chip signal routing layer. The patch antenna element achieves a 10-dB input impedance bandwidth of 10.64 GHz from 56.08 to 66.72 GHz and a maximal peak realized gain of 5.48 dBi at 63 GHz. A 4×4 antenna array is formed in a small form factor of 10×10×0.25 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and achieved a maximal peak realized gain of 13.61 dBi at 65 GHz.