Mian Zhi Ding

Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology

David Ho, Mian Zhi Ding, Xiaowu Zhang · 2015 · 97 citations

Architecture, Materials Engineering, Materials Science +13

Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging

David Ho, Mian Zhi Ding, Daniel Rhee MinWoo · 2016 · 83 citations

Engineering, Materials Engineering, Materials Science +13

Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging

Yong Han, Mian Zhi Ding, Lin Bu et al. · 2016 · 29 citations

Engineering, Materials Science, Heat Transfer +12

Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling

Fa Xing, Masaya Kawano, Mian Zhi Ding et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 23 citations

Engineering, Materials Engineering, Materials Science +16

Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package

Zhaohui Chen, Fa Xing, Mian Zhi Ding et al. · 2017 · 17 citations

Engineering, Materials Engineering, Materials Science +17