Concepedia

Masaya Kawano

MK

15

Publications

552

Citations

13

H-Index

1998

Active since

Affiliations

Agency for Science, Technology and Research(Current)

Institute of Microelectronics

Renesas Electronics (Japan)

Oki Electric Industry (Japan)

Masaya Kawano is an author at Agency for Science, Technology and Research specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringComputer Engineering3D Integration3D PrintingMaterial ScienceComputer ArchitectureApplied Physics

Publications per year

1998–2021

15

Publications

15

Three-Dimensional Packaging Technology for Stacked DRAM With 3-Gb/s Data Transfer

Masaya Kawano, Nobuaki Takahashi, Yoichiro Kurita et al. · IEEE Transactions on Electron Devices · 2008 · 75 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +14

A 3D Stacked Memory Integrated on a Logic Device Using SMAFTI Technology

Yoichiro Kurita, S. Matsui, Nobuaki Takahashi et al. · 2007 · 74 citations

Engineering, Emerging Memory Technology, Computer Architecture +21

Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages

Lin Ji, Fa Xing, Hong Ji et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 59 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Dielectric Materials Characterization for Hybrid Bonding

Vivek Chidambaram, Prayudi Lianto, Xiangyu Wang et al. · 2021 · 59 citations

Dielectrics, Engineering, Pecvd Teos Sio2 +17

System in wafer-level package technology with RDL-first process

Norikazu Motohashi, Takehiro Kimura, Kazuyuki MINEO et al. · 2011 · 56 citations

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