Concepedia

Yen Yi Germaine Hoe

YY

4

Publications

114

Citations

4

H-Index

2009

Active since

Affiliations

Institute of Microelectronics(Current)

Agency for Science, Technology and Research

Yen Yi Germaine Hoe is an author at Institute of Microelectronics specializing in electrical engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringHeat TransferApplied PhysicsMicrofabricationThermal EngineeringComputer EngineeringNanoelectronics

Publications per year

2009–2013

4

Publications

4

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 52 citations

Engineering, Integrated Circuits, Continuous Push +16

Effect of TSV interposer on the thermal performance of FCBGA package

Yen Yi Germaine Hoe, Tang Gong Yue, D. Pinjala et al. · 2009 · 37 citations

Engineering, Thermal Conductivity, Advanced Packaging (Semiconductors) +17

A Thermal Isolation Technique Using Through-Silicon Vias for Three-Dimensional ICs

Sanming Hu, Yen Yi Germaine Hoe, Hongyu Li et al. · IEEE Transactions on Electron Devices · 2013 · 15 citations

Three-dimensional Ics, Engineering, Silicon On Insulator +19

Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages

Yen Yi Germaine Hoe, Yap Guan Jie, V. S. Rao et al. · 2012 · 10 citations

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