Yen Yi Germaine Hoe - Concepedia

Author

Yen Yi Germaine Hoe

Also Known As

Y Y G Hoe, Y. Y. Hoe, Yen Yi Germaine Hoe

Publications

138

Citations

H-Index

Concepts

All Affiliations

Yen Yi Germaine Hoe is an author at Institute of Microelectronics specializing in electrical engineering, electronic packaging, and microelectronics.

#	Concept	H-Index	Publications	Citations
1	Engineering	3	3	104
2	Electrical Engineering	3	3	104
3	Applied Physics	2	2	67
4	Computer Engineering	2	2	52
5	Advanced Packaging	1	1	52

Yen Yi Germaine Hoe

Publications

114

Citations

H-Index

Page 1

	Year	Citations
Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer Tai Chong Chai, Xiaowu Zhang, John H. Lau, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringIntegrated CircuitsContinuous PushInterconnect (Integrated Circuits)Daisy Chain	2011	52
Effect of TSV interposer on the thermal performance of FCBGA package Yen Yi Germaine Hoe, Tang Gong Yue, D. Pinjala, EngineeringThermal ConductivityAdvanced Packaging (Semiconductors)Thermal ModelingThermal Conduction	2009	37
A Thermal Isolation Technique Using Through-Silicon Vias for Three-Dimensional ICs Sanming Hu, Yen Yi Germaine Hoe, Hongyu Li, IEEE Transactions on Electron Devices Three-dimensional IcsEngineeringSilicon On InsulatorInterconnect (Integrated Circuits)3-D Integrated Circuit	2013	15
Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages Yen Yi Germaine Hoe, Yap Guan Jie, V. S. Rao,	2012	10

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