V. S. Rao

Development of 3-D Silicon Module With TSV for System in Packaging

Navas Khan, V. S. Rao, Sharon Pei-Siang Lim et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 120 citations

Engineering, Electrical Engineering, Materials Engineering +17

Stability and response to rolling of the interfaces in cast Al–SiCp and Al–Mg alloy-SiCp composites

Rahul Mitra, V. S. Rao, R. Maiti · Materials Science and Engineering A · 2004 · 61 citations

Engineering, Materials Engineering, Materials Science +14

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 55 citations

Engineering, Electrical Engineering, Electronic Materials +16

Evaluation of laser solder ball jetting for solder ball attachment process

Mian Zhi Ding, Leong Ching Wai, Shiyun Zhang et al. · 2012 · 11 citations

Engineering, Electrical Engineering, Materials Engineering +6

Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages

Yen Yi Germaine Hoe, Yap Guan Jie, V. S. Rao et al. · 2012 · 10 citations

Engineering, Materials Engineering, Materials Science +17