Leong Ching Wai

Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure

Daquan Yu, Tai Chong Chai, Meei Ling Thew et al. · 2009 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

Development of Six-Degree-of-Freedom Inertial Sensors With an 8-in Advanced MEMS Fabrication Platform

Guoqiang Wu, Beibei Han, Daw Don Cheam et al. · IEEE Transactions on Industrial Electronics · 2018 · 25 citations

Engineering, Mechanical Engineering, Mechatronics Engineering +17

Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module

Gongyue Tang, Leong Ching Wai, Siak Boon Lim et al. · 2021 · 24 citations

Engineering, Materials Engineering, Materials Science +16

Failure Mode and Mechanism Analysis for Cu Wire Bond on Cu/Low-k Chip by Wire Pull Test and Finite-Element Analysis

Fa Xing, Leong Ching Wai, Tai Chong Chai · IEEE Transactions on Device and Materials Reliability · 2018 · 23 citations

Engineering, Materials Engineering, Materials Science +15

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

Xuefen Ong, Soon Wee Ho, Yue Ying Ong et al. · Microelectronics Reliability · 2009 · 20 citations

Engineering, Materials Engineering, Packaging Design +7