Concepedia

Ho Siow Ling

HS

2

Publications

54

Citations

2

H-Index

2014

Active since

Affiliations

Agency for Science, Technology and Research(Current)

Institute of Microelectronics

Ho Siow Ling is an author at Agency for Science, Technology and Research specializing in microelectronics, materials science, and industrial design.

Top concepts

3D PrintingEngineeringMaterial ScienceMicroelectronicsMicrofabricationIndustrial DesignComputer EngineeringElectronic PackagingMechanical EngineeringMechanics Of Materials

Publications per year

2014–2014

2

Publications

2

High power SiC inverter module packaging solutions for junction temperature over 220°C

Daniel Rhee Min Woo, How Yuan Hwang, Jerry Aw Jie Li et al. · 2014 · 31 citations

Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages

Ho Siow Ling, Lin Bu, Chong Ser Choong et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 23 citations

Wafer Level Molding, Engineering, Mechanical Engineering +20

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