Vito Lin

High Reliability Solution of 2.5D Package Technologies

Hsin Jou Lin, Vito Lin, Joe Lin et al. · 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) · 2021 · 21 citations

Engineering, Computer Engineering, High-performance Computing +17

The Optimal Solution of Fan-Out Embedded Bridge (FO-EB) Package Evaluation during the Process and Reliability Test

Vito Lin, David Lai, Yu-Po Wang · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 16 citations

Engineering, Computer Engineering, Packaging Design +16

Stress simulation and design optimal study for Cu pillar bump structure

Vito Lin, Nicholas Kao, Don Son Jiang et al. · 2013 · 14 citations

Engineering, Materials Engineering, Materials Science +13

Fan-Out Embedded Bridge with TSV(FO-EB-T) Package Characterization and Evaluation

Vito Lin, Teny Shih, Andrew H. Kang et al. · 2023 · 10 citations

Engineering, Computer Engineering, Electrical Engineering +17