Yu-Po Wang

Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis

Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin et al. · Micromachines · 2023 · 66 citations · Full text

Computing, Computer Science, Electrical Engineering +15

EMI Shielding Technology in 5G RF System in Package Module

Jay Li, Mike Tsai, Ryan Chiu et al. · 2020 · 37 citations

Engineering, Computer Engineering, Electrical Engineering +17

Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Mike Tsai, Ryan Chiu, Dick Huang et al. · 2019 · 22 citations

Agriculture, Materials Engineering, Internet Of Things +16

Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization

Li‐Chi Huang, Chih‐Ming Chen, Liang-Yih Hung et al. · Materials Characterization · 2021 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +14

Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration

Jay Lia, F. J. Tsai, Jackson Li et al. · 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) · 2021 · 21 citations

Engineering, Computer Engineering, Electronic Materials +15