Yu-Po Wang

Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis

Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin et al. · Micromachines · 2023 · 64 citations · Full text

EMI Shielding Technology in 5G RF System in Package Module

Jay Li, Mike Tsai, Ryan Chiu et al. · 2020 · 34 citations

Electrical Engineering, Millimeter Wave Technology, Engineering +15

Innovative Packaging Solutions of 3D Double Side Molding with System in Package for IoT and 5G Application

Mike Tsai, Ryan Chiu, Dick Huang et al. · 2019 · 22 citations

Advanced Packaging, Materials Science, 3D Ic Architecture +13

Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization

Li-Chi Huang, Yanping Zhang, Chih‐Ming Chen et al. · Materials Characterization · 2021 · 21 citations

Materials Science, Materials Engineering, Growth Behavior +10

Comparative Analysis of Electrical Performance on Coreless and Standard Flip-Chip Substrate

Robert Sung, Kevin Chiang, Yu-Po Wang et al. · 2007 · 20 citations

Engineering, Computer Architecture, Electrical Performance +19