King-Jien Chui - Concepedia

Author

King-Jien Chui

Institute of Microelectronics

Also Known As

K. M. Chui, K.M. Chui, King-Jien Chui, King-jien Chui

Publications

475

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics National University of Singapore Agency for Science, Technology and Research Taiwan Semiconductor Manufacturing Company (Taiwan)

About

King-Jien Chui is an author at Institute of Microelectronics specializing in engineering, applied physics, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	257
2	Applied Physics	8	8	240
3	Electrical Engineering	6	6	216
4	Natural Sciences	1	1	12
5	Computer Engineering	1	1	16

King-Jien Chui

Publications

335

Citations

H-Index

Page 1

	Year	Citations
Lattice strain analysis of transistor structures with silicon–germanium and silicon–carbon source∕drain stressors Kah‐Wee Ang, King-Jien Chui, Vladimir Bliznetsov, Applied Physics Letters EngineeringMechanical EngineeringSilicon–carbon Source∕drain StressorsSige Source∕drain StressorsSemiconductor Device	2005	111
n-MOSFET With Silicon Carbon Source/Drain for Enhancement of Carrier Transport King-Jien Chui, Kah‐Wee Ang, Narayanan Balasubramanian, IEEE Transactions on Electron Devices	2007	53
Thin body silicon-on-insulator N-MOSFET with silicon-carbon source/drain regions for performance enhancement Kah‐Wee Ang, King-Jien Chui, Vladimir Bliznetsov, Low-power ElectronicsSemiconductorsElectrical EngineeringPerformance EnhancementEngineering	2006	29
Performance Enhancement in Uniaxial Strained Silicon-on-Insulator N-MOSFETs Featuring Silicon–Carbon Source/Drain Regions Kah‐Wee Ang, King-Jien Chui, Chih-Hang Tung, IEEE Transactions on Electron Devices SemiconductorsSemiconductor TechnologyElectrical EngineeringPerformance EnhancementEngineering	2007	24
Enhanced Strain Effects in 25-nm Gate-Length Thin-Body nMOSFETs With Silicon–Carbon Source/Drain and Tensile-Stress Liner Kah‐Wee Ang, King-Jien Chui, Chih-Hang Tung, IEEE Electron Device Letters Device ModelingElectrical EngineeringSub XmlnsEngineeringStrain-induced Mobility Enhancement	2007	22
Detection of a single magnetic dot using a Planar Hall sensor King-Jien Chui, A. O. Adeyeye, Mo‐Huang Li Journal of Magnetism and Magnetic Materials MagnetismEngineeringSingle Magnetic DotMagnetic MeasurementInstrumentation	2006	17
Wafer Level High Density Hybrid Bonding for High Performance Computing Hongmiao Ji, Lin Ji, Fa Xing, EngineeringW2w Alignment AccuracyComputer ArchitectureStack IntegrationHigh Performance Computing	2020	16
Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding Hongmiao Ji, King-Jien Chui 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)	2021	15
Strained Thin-Body p-MOSFET With Condensed Silicon-Germanium Source/Drain for Enhanced Drive Current Performance Kah‐Wee Ang, King-Jien Chui, Anuj Madan, IEEE Electron Device Letters Semiconductor TechnologyElectrical EngineeringEngineeringCondensed Silicon-germanium Source/drainNanoelectronics	2007	14
Temperature dependence of magnetotransport properties of Ni80Fe20∕Fe50Mn50∕Ni80Fe20 trilayers King-Jien Chui, D. Tripathy, A. O. Adeyeye Journal of Applied Physics Materials ScienceMagnetismMagnetic PropertiesFerromagnetismSeed Layer Thickness	2007	12

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