Warpage
Warpage is a polymer processing defect characterized by unintended dimensional distortion or deformation of a manufactured part, arising from non-uniform cooling, residual stresses, or anisotropic material shrinkage during solidification in blow molding and polymer additive manufacturing.
751
Publications
22.9K
Citations
2.5K
Authors
530
Institutions
Publications per year
2017–2026
275
751
1–5 of 751
2.5K
12
h-index
11
h-index
10
h-index
9
h-index
8
h-index
1–5 of 2.5K
530
Georgia Institute of Technology
Atlanta, United States
18 h-index
93 publications
2.5K citations
Institute of Microelectronics
Singapore, Singapore
16 h-index
148 publications
4.1K citations
Agency for Science, Technology and Research
Singapore, Singapore
15 h-index
153 publications
4.3K citations

Delft University of Technology
Delft, The Netherlands
14 h-index
44 publications
1.4K citations
Samsung (South Korea)
Seoul, South Korea
14 h-index
75 publications
2.4K citations
Advanced Semiconductor Engineering (Taiwan)
Kaohsiung, Taiwan
13 h-index
58 publications
1.6K citations
Binghamton University
Binghamton, United States
12 h-index
42 publications
1.3K citations
National Cheng Kung University
Tainan City, Taiwan
12 h-index
35 publications
923 citations
1–8 of 530
27 publications · 909 citations
20
h-index
28 publications · 940 citations
20
h-index
19 publications · 1.6K citations
16
h-index
16 publications · 504 citations
15
h-index
17 publications · 444 citations
14
h-index
1–5