Concepedia

Yuling Niu

YN

Statistics

Publications

16

Citations

389

H-Index

13

Active since

2015

Affiliations

Binghamton University(Current)

Xilinx (United States)

Yuling Niu is an author at Binghamton University specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of Materials3D PrintingMaterial ScienceMicroelectronicsThermal EngineeringCalibrationHeat Transfer

Publications per year

2015–2020

16

Publications

16

Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management

Ji-Sun Hong, Kyoungsei Choi, Dan Oh et al. · 2018 · 49 citations

Engineering, Mechanical Engineering, Area Ratio +18

Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling

Shuai Shao, Yuling Niu, Jing Wang et al. · 2018 · 47 citations

Engineering, Energy Efficiency, Maximum Junction Temperature +19

Modeling and Design of 2.5D Package with Mitigated Warpage and Enhanced Thermo-Mechanical Reliability

Jing Wang, Yuling Niu, Seungbae Park et al. · 2018 · 36 citations

Engineering, Package Level, Mechanical Engineering +20

A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow

Jing Wang, Yuling Niu, Shuai Shao et al. · Microelectronics Reliability · 2020 · 33 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +9

A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method

Yuling Niu, Jing Wang, Shuai Shao et al. · Microelectronics Reliability · 2018 · 30 citations

Reliability, Reliability Engineering, Engineering +12

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