Concepedia

Seungbae Park

SP

87

Publications

3.1K

Citations

28

H-Index

1994

Active since

Affiliations

Binghamton University(Current)

Analog Devices (United States)

Corning (United States)

Samsung (South Korea)

Xilinx (United States)

Seungbae Park is an author at Binghamton University specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingMechanics Of MaterialsMaterial ScienceThermal EngineeringElectrical EngineeringSolid MechanicsMicroelectronicsHeat Transfer

Publications per year

1994–2023

87

Publications

87

Fracture Criteria for Piezoelectric Ceramics

Seungbae Park, Chin‐Teh Sun · Journal of the American Ceramic Society · 1995 · 604 citations

Materials Science, Engineering, Mechanical Properties +11

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

Da Yu, Abdullah Al-Yafawi, Tung Nguyen et al. · Microelectronics Reliability · 2010 · 147 citations

Engineering, Pb-free Bga, Service Life Prediction +5

Design, fabrication, and experimental characterization of a flap valve IPMC micropump with a flexibly supported diaphragm

Thanh Tung Nguyen, Nam Seo Goo, Vinh Khanh Nguyen et al. · Sensors and Actuators A Physical · 2007 · 101 citations

Engineering, Microfabrication, Mechanical Engineering +5

Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading

Seungbae Park, Ramji Dhakal, L.P. Lehman et al. · Acta Materialia · 2007 · 98 citations

Materials Science, Situ Thermal Loading, Engineering +12

A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs

Chongyang Cai, Jiefeng Xu, Huayan Wang et al. · Microelectronics Reliability · 2021 · 84 citations

Materials Science, Materials Engineering, Alloy Bgas +8

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