Concepedia

Huayan Wang

HW

Statistics

Publications

19

Citations

463

H-Index

14

Active since

2007

Affiliations

Binghamton University(Current)

Xilinx (United States)

Corning (United States)

Peking University

State University of New York

Huayan Wang is an author at Binghamton University specializing in materials science, materials engineering, and engineering.

Publications per year

2007–2025

19

Publications

19

A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs

Chongyang Cai, Jiefeng Xu, Huayan Wang et al. · Microelectronics Reliability · 2021 · 85 citations

Natural Sciences, Materials Engineering, Materials Science +17

Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management

Ji-Sun Hong, Kyoungsei Choi, Dan Oh et al. · 2018 · 50 citations

Engineering, Design, Materials Engineering +17

A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow

Jing Wang, Yuling Niu, Shuai Shao et al. · Microelectronics Reliability · 2020 · 35 citations

Agriculture, Materials Engineering, Materials Science +14

The effect of solder paste volume on solder joint shape and self-alignment of passive components

Ke Pan, Jong Hwan Ha, Van Lai Pham et al. · 2020 · 32 citations

Engineering, Materials Engineering, Materials Science +13

A Comprehensive Study of Electromigration in Lead-free Solder Joint

Jiefeng Xu, Chongyang Cai, Vanlai Pham et al. · 2020 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +16

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