Chongyang Cai

A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs

Chongyang Cai, Jiefeng Xu, Huayan Wang et al. · Microelectronics Reliability · 2021 · 84 citations

Materials Science, Materials Engineering, Alloy Bgas +8

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Yangyang Lai, Ke Pan, Yuqiao Cen et al. · Soldering and Surface Mount Technology · 2022 · 34 citations

Intelligent System, Engineering, Machine Learning +19

A Comprehensive Study of Electromigration in Lead-free Solder Joint

Jiefeng Xu, Chongyang Cai, Vanlai Pham et al. · 2020 · 29 citations

Engineering, Homogeneous Snbi58, Power Electronic Systems +18

Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components

Yangyang Lai, Ke Pan, Chongyang Cai et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 27 citations

Engineering, Energy Efficiency, Mechanical Engineering +20

Comparative Analysis of Package Warpage Using Confocal Method and Digital Image Correlation

Chongyang Cai, Ke Pan, Junbo Yang et al. · 2020 · 23 citations

Image Analysis, Engineering, Ophthalmology +14