Concepedia

Yangyang Lai

YL

16

Publications

290

Citations

12

H-Index

2021

Active since

Affiliations

Binghamton University(Current)

Corning (United States)

Yangyang Lai is an author at Binghamton University specializing in engineering, electronic packaging, and thermal engineering.

Top concepts

EngineeringElectronic PackagingThermal EngineeringHeat TransferMechanical EngineeringMaterial ScienceThermal ModelingThermal ManagementComputer EngineeringMechanics Of Materials

Publications per year

2021–2023

16

Publications

16

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Yangyang Lai, Ke Pan, Yuqiao Cen et al. · Soldering and Surface Mount Technology · 2022 · 34 citations

Intelligent System, Engineering, Machine Learning +19

In-situ temperature-dependent characterization of copper through glass via (TGV)

Ke Pan, Jiefeng Xu, Yangyang Lai et al. · Microelectronics Reliability · 2022 · 29 citations

Materials Science, Glass-ceramic, Engineering +4

Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components

Yangyang Lai, Ke Pan, Chongyang Cai et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 27 citations

Engineering, Energy Efficiency, Mechanical Engineering +20

Determination of Smarter Reflow Profile to Achieve a Uniform Temperature Throughout a Board

Yangyang Lai, Ke Pan, Jiefeng Xu et al. · 2021 · 23 citations

Solder Temperatures, Engineering, Smarter Reflow Profile +20

Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling

Ke Pan, Jiefeng Xu, Yangyang Lai et al. · 2021 · 23 citations

Engineering, Glass-forming Liquid, Mechanical Engineering +21

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