Concepedia

Ke Pan

KP

26

Publications

529

Citations

17

H-Index

2007

Active since

Affiliations

Binghamton University(Current)

Corning (United States)

Xilinx (United States)

Central South University

Dalian Jiaotong University

Ke Pan is an author at Binghamton University specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringThermal EngineeringHeat TransferMaterial ScienceMechanics Of MaterialsElectrical EngineeringSolid MechanicsMicroelectronics

Publications per year

2007–2022

26

Publications

26

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Yangyang Lai, Ke Pan, Yuqiao Cen et al. · Soldering and Surface Mount Technology · 2022 · 34 citations

Intelligent System, Engineering, Machine Learning +19

The effect of solder paste volume on solder joint shape and self-alignment of passive components

Ke Pan, Jong Hwan Ha, Van Lai Pham et al. · 2020 · 32 citations

Materials Science, Solder Paste Volume, Solder Joint Shape +13

A Comprehensive Study of Electromigration in Lead-free Solder Joint

Jiefeng Xu, Chongyang Cai, Vanlai Pham et al. · 2020 · 29 citations

Engineering, Homogeneous Snbi58, Power Electronic Systems +18

An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors

Ke Pan, Jong Hwan Ha, Huayan Wang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 29 citations

Engineering, Mechanical Engineering, Molten Solder +16

In-situ temperature-dependent characterization of copper through glass via (TGV)

Ke Pan, Jiefeng Xu, Yangyang Lai et al. · Microelectronics Reliability · 2022 · 29 citations

Materials Science, Glass-ceramic, Engineering +4

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