Concepedia

Vanlai Pham

VP

8

Publications

167

Citations

8

H-Index

2018

Active since

Affiliations

Binghamton University(Current)

Xilinx (United States)

Corning (United States)

Vanlai Pham is an author at Binghamton University specializing in electronic packaging, engineering, and mechanics of materials.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMechanics Of MaterialsElectrical EngineeringMechanical EngineeringHeat TransferMicroelectronicsThermal EngineeringElectrical Insulation

Publications per year

2018–2020

8

Publications

8

A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow

Jing Wang, Yuling Niu, Shuai Shao et al. · Microelectronics Reliability · 2020 · 33 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +9

A Comprehensive Study of Electromigration in Lead-free Solder Joint

Jiefeng Xu, Chongyang Cai, Vanlai Pham et al. · 2020 · 29 citations

Engineering, Homogeneous Snbi58, Power Electronic Systems +18

Investigation of underfilling BGAs packages – Thermal fatigue

Vanlai Pham, Jiefeng Xu, Ke Pan et al. · 2020 · 26 citations

Plastic Strain Accumulation, Engineering, Mechanical Engineering +16

A Study of Substrate Models and Its Effect On Package Warpage Prediction

Vanlai Pham, Huayan Wang, Jiefeng Xu et al. · 2019 · 22 citations

Food Packaging, Engineering, Industrial Engineering +18

Product Level Design Optimization for 2.5D Package Pad Cratering Reliability During Drop Impact

Huayan Wang, Jing Wang, Jiefeng Xu et al. · 2019 · 21 citations

Engineering, Impact (Mechanics), Structural Crashworthiness +19

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