Concepedia

Junbo Yang

JY

16

Publications

306

Citations

12

H-Index

2015

Active since

Affiliations

Binghamton University(Current)

Junbo Yang is an author at Binghamton University specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringThermal EngineeringElectronic PackagingHeat TransferThermal ModelingThermal ManagementComputer EngineeringRefrigerationThermodynamics

Publications per year

2015–2023

16

Publications

16

Optimal design of blended composite laminate structures using ply drop sequence

Junbo Yang, Bifeng Song, Xiaoping Zhong et al. · Composite Structures · 2015 · 49 citations

Materials Science, Fibre-reinforced Plastic, Engineering +7

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Yangyang Lai, Ke Pan, Yuqiao Cen et al. · Soldering and Surface Mount Technology · 2022 · 34 citations

Intelligent System, Engineering, Machine Learning +19

Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components

Yangyang Lai, Ke Pan, Chongyang Cai et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 27 citations

Engineering, Energy Efficiency, Mechanical Engineering +20

Comparative Analysis of Package Warpage Using Confocal Method and Digital Image Correlation

Chongyang Cai, Ke Pan, Junbo Yang et al. · 2020 · 23 citations

Image Analysis, Engineering, Ophthalmology +14

Determination of Smarter Reflow Profile to Achieve a Uniform Temperature Throughout a Board

Yangyang Lai, Ke Pan, Jiefeng Xu et al. · 2021 · 23 citations

Solder Temperatures, Engineering, Smarter Reflow Profile +20

Rows per page

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