Concepedia

Dan Oh

DO

33

Publications

774

Citations

17

H-Index

2006

Active since

Affiliations

Rambus (United States)(Current)

Rambus (United Kingdom)

Samsung (South Korea)

Altera (United States)

Dan Oh is an author at Rambus (United States) specializing in engineering, computer engineering, and electrical engineering.

Top concepts

EngineeringComputer EngineeringComputer ArchitectureElectrical EngineeringMicroelectronicsVlsi DesignSignal ProcessingHardware SecuritySystems EngineeringElectronic Packaging

Publications per year

2006–2022

33

Publications

33

Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications

Kyoung-Lim Suk, Seok Hyun Lee, Jong‐Youn Kim et al. · 2018 · 66 citations

Engineering, Vlsi Design, Computer Architecture +21

Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages

Se-Ho You, Seong-Hwan Jeon, Dan Oh et al. · 2018 · 61 citations

Engineering, Computer Architecture, Industry Revolution +20

Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems

Joong-Ho Kim, Dan Oh, Woopoung Kim · IEEE Transactions on Advanced Packaging · 2010 · 59 citations

Transmission Lines, Electrical Engineering, Accurate Characterization +12

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel et al. · Journal of Electronic Packaging · 2020 · 59 citations · Full text

Engineering, Metamaterials, Electromagnetic Metamaterials +17

Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management

Ji-Sun Hong, Kyoungsei Choi, Dan Oh et al. · 2018 · 49 citations

Engineering, Mechanical Engineering, Area Ratio +18

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