Dan Oh - Concepedia

Author

Dan Oh

Rambus (United States)

Also Known As

Dan Kyung Suk Oh, Dan Oh

Publications

957

Citations

H-Index

Concepts

All Affiliations

Rambus (United States)Rambus (United Kingdom)Samsung (South Korea)Altera (United States)

About

Dan Oh is an author at Rambus (United States) specializing in engineering, computer engineering, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	31	752
2	Computer Engineering	16	29	679
3	Computer Science	3	3	40
4	Education	1	1	13
5	Applied Physics	1	1	59

Dan Oh

Publications

774

Citations

H-Index

Page 1

	Year	Citations
Low Cost Si-Less RDL Interposer Package for High Performance Computing Applications Kyoung-Lim Suk, Seok Hyun Lee, Jong‐Youn Kim, EngineeringVlsi DesignComputer ArchitecturePower Electronic SystemsIntegrated Circuits	2018	66
Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages Se-Ho You, Seong-Hwan Jeon, Dan Oh, EngineeringComputer ArchitectureIndustry RevolutionNovel Rdl PackagesRefrigeration	2018	61
Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems Joong-Ho Kim, Dan Oh, Woopoung Kim IEEE Transactions on Advanced Packaging Transmission LinesElectrical EngineeringAccurate CharacterizationEngineeringElectrical Transmission	2010	59
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging Jae Choon Kim, Zongqing Ren, Anil Yuksel, Journal of Electronic Packaging EngineeringMetamaterialsElectromagnetic MetamaterialsThermal ConductivityThermal Conduction	2020	59
Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management Ji-Sun Hong, Kyoungsei Choi, Dan Oh, EngineeringMechanical EngineeringArea RatioDesign GuidelineAdvanced Packaging (Semiconductors)	2018	49
Multiple Edge Responses for Fast and Accurate System Simulations Dan Oh EngineeringVlsi DesignDirect Numerical SimulationComputer ArchitectureSimulation	2006	29
Study of Advanced Fan-Out Packages for Mobile Applications Taejoo Hwang, Dan Oh, Eunseok Song, EngineeringEnergy EfficiencyComputer ArchitectureAdvanced Fan-out PackagesRefrigeration	2018	28
Performance Impact of Simultaneous Switching Output Noise on Graphic Memory Systems Joong-Ho Kim, Woopoung Kim, Dan Oh, Non-volatile MemoryEngineeringVlsi DesignGraphic Memory SystemsComputer Architecture	2007	26
Precursor ISI Reduction in High-Speed I/O Jihong Ren, Haechang Lee, Lin Qi, Low-power ElectronicsElectrical EngineeringEqualization AdaptationEngineeringVlsi Design	2007	26
Improving the target impedance method for PCB decoupling of core power Guang Chen, Dan Oh Hardware SecurityElectrical EngineeringEngineeringCore PowerPower Optimization (Eda)	2014	25

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