Zongqing Ren - Concepedia

Author

Zongqing Ren

University of California, Irvine ORCID

Also Known As

Zongqing Ren

Publications

324

Citations

H-Index

Concepts

All Affiliations

University of California, Irvine Samsung (South Korea)

About

Zongqing Ren is an author at University of California, Irvine specializing in heat transfer, microelectronics, and engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	178
2	Electrical Engineering	4	4	151
3	Applied Physics	3	3	100
4	Computer Engineering	2	2	78
5	Materials Science	2	2	86

Zongqing Ren

Publications

304

Citations

H-Index

Page 1

	Year	Citations
Hydrogen bonded and ionically crosslinked high strength hydrogels exhibiting Ca<sup>2+</sup>-triggered shape memory properties and volume shrinkage for cell detachment Zongqing Ren, Yinyu Zhang, Yongmao Li, Journal of Materials Chemistry B	2015	69
Thermal TSV Optimization and Hierarchical Floorplanning for 3-D Integrated Circuits Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringVlsi DesignIc BlocksComputer ArchitectureComputer-aided Design	2020	62
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging Jae Choon Kim, Zongqing Ren, Anil Yuksel, Journal of Electronic Packaging EngineeringMetamaterialsElectromagnetic MetamaterialsThermal ConductivityThermal Conduction	2020	59
Phononic topological insulators based on six-petal holey silicon structures Ziqi Yu, Zongqing Ren, Jaeho Lee Scientific Reports	2019	31
Thermal conductivity anisotropy in holey silicon nanostructures and its impact on thermoelectric cooling Zongqing Ren, Jaeho Lee Nanotechnology EngineeringThermoelectricsArtificial NanostructuresThermal ConductivityNanoelectronics	2017	27
TSV-integrated thermoelectric cooling by holey silicon for hot spot thermal management Zongqing Ren, Ziqi Yu, Jae Choon Kim, Nanotechnology	2018	26
System-Level Analysis of 3D ICs with Thermal TSVs Ayed Alqahtani, Zongqing Ren, Jaeho Lee, ACM Journal on Emerging Technologies in Computing Systems EngineeringVlsi DesignComputer ArchitectureSystem-level DesignIntegrated Circuits	2018	16
Transient Cooling and Heating Effects in Holey Silicon-Based Lateral Thermoelectric Devices for Hot Spot Thermal Management Zongqing Ren, Jae Choon Kim, Jaeho Lee IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringThermoelectricsLateral Thermoelectric DevicesThermal ProcessesHeating Effects	2021	14

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