Concepedia

Jae Choon Kim

JC

3

Publications

99

Citations

3

H-Index

2018

Active since

Affiliations

University of California, Irvine(Current)

Samsung (South Korea)

Jae Choon Kim is an author at University of California, Irvine specializing in electrical engineering, microelectronics, and thermal engineering.

Top concepts

Publications per year

2018–2021

3

Publications

3

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel et al. · Journal of Electronic Packaging · 2020 · 59 citations · Full text

, , +17

TSV-integrated thermoelectric cooling by holey silicon for hot spot thermal management

Zongqing Ren, Ziqi Yu, Jae Choon Kim et al. · Nanotechnology · 2018 · 26 citations

Transient Cooling and Heating Effects in Holey Silicon-Based Lateral Thermoelectric Devices for Hot Spot Thermal Management

Zongqing Ren, Jae Choon Kim, Jaeho Lee · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 14 citations

, , +22

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